인공위성용 3차원 메모리 패키징 기술
3D SDRAM Package Technology for a Satellite
- 한국마이크로전자및패키징학회
- 마이크로전자 및 패키징학회지
- 제19권 제1호
- : KCI등재후보
- 2012.03
- 25 - 32 (8 pages)
Package for artificial satellite is to produce mass production for high package with reliability certification as well as develop SDRAM (synchronous dynamic RAM) module which has such as miniaturization, mass storage, and high reliability in space environment. It requires sophisticated technology with chip stacking or package stacking in order to increase up to 4Gbits or more for mass storage with space technology. To make it better, we should secure suitable processes by doing design, manufacture, and debugging. Pin type PCB substrate was then applied to QFP-Pin type 3D memory package fabrication. These results show that the 3D memory package for artificial satellite scheme is a promising candidate for the realization of our own domestic technologies.
1. 서론
2. 본론
3. 결론
감사의 글
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