효율적 수치해석기법을 이용한 반도체 페키지의 열방출 해석

Efficient Approach to Thermal Modeling for IC Packages

An efficient method for thermal modeling of QFP is Proposed. Thermal measurement data are given to verify the method. In parallel with the experiment, an exact full 3-D model calculation is also provided. One fonds that there is an excellent agreement between validation data and the efficient model data.

1. INTRODUCTION

2. Modeling Analysis

3. Simplified approach to the modeling

4. Thermal Test Procedure

5. Results and Discussions

6. Acknowledgements

REFERENCES

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