학술저널
Critical Cleaning Requirements for Flip Chip Packages
Critical Cleaning Requirements for Flip Chip Packages
- 한국마이크로전자및패키징학회
- 마이크로전자 및 패키징학회지
- 제7권 제1호
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2000.0361 - 73 (13 pages)
- 0
In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology.
Flip Chip Technology
Reliability
Why Clean?
Flip Chip Cleaning issues
Keys to Successful Flip Chip Cleaning Processes
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