학술저널
Failure Paths Analyses of the Leadframe/EMC System
Failure Paths Analyses of the Leadframe/EMC System
- 한국마이크로전자및패키징학회
- 마이크로전자 및 패키징학회지
- 제7권 제2호
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2000.067 - 12 (6 pages)
- 0
Copper-based leadframe sheets were oxidized in a black-oxide forming solution, and molded with epoxy molding compound (EMC) to form sandwiched double-cantilever beam (SDCB) specimens. The adhesion strength of leadframe/EMC interface was measured in terms of fracture toughness by using SDCB specimens and the fracture surfaces were analyzed by various equipments such as glancing-angle XRD, AFM, and SEM. Results showed that three types of failure paths, which were closely related to the surface condition of leadframes before molding.
1. Introduction
2. Experimental Procedure
3. Results and Discussion
4. Conclusions
References
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