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KCI등재 학술저널

Failure Paths Analyses of the Leadframe/EMC System

Failure Paths Analyses of the Leadframe/EMC System

Copper-based leadframe sheets were oxidized in a black-oxide forming solution, and molded with epoxy molding compound (EMC) to form sandwiched double-cantilever beam (SDCB) specimens. The adhesion strength of leadframe/EMC interface was measured in terms of fracture toughness by using SDCB specimens and the fracture surfaces were analyzed by various equipments such as glancing-angle XRD, AFM, and SEM. Results showed that three types of failure paths, which were closely related to the surface condition of leadframes before molding.

1. Introduction

2. Experimental Procedure

3. Results and Discussion

4. Conclusions

References

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