상세검색
최근 검색어 전체 삭제
다국어입력
즐겨찾기0
한국마이크로전자및패키징학회.jpg
KCI등재 학술저널

Multi-Chip Packaging for Mobile Telephony

Multi-Chip Packaging for Mobile Telephony

This paper presents product level considerations for multichip packaging as a cost effective alternative to single chip packaging in the design and manufacture of mobile telephony products. Important aspects include component functionality and complexity, acquisition and logistics costs, product modularity and integration. Multichip packaging offers unique solutions and significant system level cost savings in many applications including RF modules, digital matrix functions and product options such as security, data storage, voice recognition, etc.

1. Introduction

2. Mobile Telephony Applications

3. Module Partitioning

4. Benefits of Modularization

로딩중