학술저널
Multi-Chip Packaging for Mobile Telephony
Multi-Chip Packaging for Mobile Telephony
- 한국마이크로전자및패키징학회
- 마이크로전자 및 패키징학회지
- 제8권 제2호
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2001.0649 - 52 (4 pages)
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This paper presents product level considerations for multichip packaging as a cost effective alternative to single chip packaging in the design and manufacture of mobile telephony products. Important aspects include component functionality and complexity, acquisition and logistics costs, product modularity and integration. Multichip packaging offers unique solutions and significant system level cost savings in many applications including RF modules, digital matrix functions and product options such as security, data storage, voice recognition, etc.
1. Introduction
2. Mobile Telephony Applications
3. Module Partitioning
4. Benefits of Modularization
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