KCI등재
학술저널
A Multi-Level Knowledge-Based Design System for Semiconductor Chip Encapsulation
A Multi-Level Knowledge-Based Design System for Semiconductor Chip Encapsulation
- 한국마이크로전자및패키징학회
- 마이크로전자 및 패키징학회지
- 제9권 제1호
- : KCI등재후보
- 2002.03
- 43 - 48 (6 pages)
Semiconductor chip encapsulation process is employed to protect the chip and to achieve optimal performance of the chip. Expert decision-making to obtain the appropriate package design or process conditions with high yields and high productivity is quite difficult. In this paper, an expert system for semiconductor chip encapsulation has been constructed which combines a knowledge-based system with CAE software.
1. Introduction
2. System Overview
3. Evaluation of the Process Condition
4. Generation of Redesign Recommendations
5. Conclusions
References