Mechanical Tenacity Analysis of Moisture Barrier Bags for Semiconductor Packages
- Kim, Keun-Soo Kim, Tae-Seong Min Yoo Yoo, Hee-Yeoul
- 마이크로전자 및 패키징학회지
- 제11권 제1호
- 등재여부 : KCI등재후보
- 43 - 47 (5 pages)
We have been using Moisture Barrier Bags for dry packing of semiconductor packages to prevent moisture from absorbing during shipping. Moisture barrier bag material is required to be waterproof, vapor proof and offer superior ESD (Electro-static discharge) and EMI shielding. Also, the bag should be formed easily to the shape of products for vacuum packing while providing excellent puncture resistance and offer very low gas ＆ moisture permeation. There are some problems like pinholes and punctured bags after sealing and before the surface mount process. This failure may easily result in package pop corn crack during board mounting. The bags should be developed to meet the requirements of excellent electrical and physical properties by means of optimization of their raw material composition and their thickness. This study investigates the performance of moisture barrier bags by characterization of their mechanical endurance, tensile strength and through thermal analysis. By this study, we arrived at a robust material composition (polyester/Aluminate) for better packing.
Results and discussion