광택Ni 도금액 중 비 전도성 차폐판을 이용한 도금두께 편차 감소에 관한 연구

A Study on the Uniformity of Plating Thickness of Ni-Plating using Insulating Plate

In this study, the effect of insulating plate on plating thickness of Ni-plating was investigated at the plating conditions of 10min of plating time, 5 or 10A/dm2 of current density, anode material of Ti Basket. The difference between maximum thickness and minimum thickness was 1.64㎛(2.14 times) at the current density of 5A/dm2, and without insulating plate. That is, the maximum thickness was 3.07㎛ and the minimum thickness was 1.43㎛. In the case of the current density of 10A/dm2, The difference was 2.91㎛(2.03 times). That is, the maximum thickness was 5.71㎛ and the minimum thickness was 2.80㎛. On the other hand, in the case of using insulating plate, The difference was 2.77㎛(1.99 times). That is, the maximum thickness was 5.56㎛ and the minimum thickness was 2.79㎛ at the current density of 5A/dm2 . And the difference was 2.98㎛(1.89 times)at the current density of 10A/dm2. That is, the maximum thickness was 6.30㎛ and the minimum thickness was 3.32㎛. These result means that using the insulating plate is an effective method for uniform plating thickness of Ni-plating.