Sn-In-Bi계 무연솔더의 특성에 관한 연구

A Study of Characterization on the Property in Pb-Free Solders of Sn-In-Bi

Effects of electronics industry has been made to minimize the use of Pb due to the environmental concerns, and the use of Pb-free solders is attempted. However, the melting temperature of lead-free solder Sn-Pb solder process is likely to have problems than those. Existing soldering equipment used was being constrained. In this research, one way to resolve the problem by intermediate melting point alloy of Sn-In-Bi solder contained of the in acordance with the feasibility of lead-free solder were investigated. Sn-10In-5Bi solder were made has a melting temperature of 180∼196℃, wettabilities of Sn-37Pb and Sn-3.5Ag solders were also studied to compare these of the Sn-In-Bi alloy. Experimental results showed that the zero-cross-time and wetting time of Sn-10In-5Bi is comparable about Sn-37Pb. and a little better than these of Sn-3.5Ag solder.