Chemical Mechanical Planarization (CMP) slurries play key role during planarization process in advanced semiconductor manufacturing, serving to planarize wafer surfaces and minimize unevenness in multi-layered device scheme. This paper provides a comprehensive review of the composition of CMP slurries and the analytical methods used to evaluate their components. The primary constituents of CMP slurries―abrasive particles, chemical agents, and various additives―are examined in detail, highlighting their roles and interactions. We report the latest research trends in CMP slurry composition and analytical methods, offering insights into future research directions and providing foundational information for optimizing CMP slurry performance. This, in turn, is expected to contribute to the ongoing advancement of the semiconductor industry and the fabrication of high-performance devices.
1. 서론
2. 본론
3. 결론
ACKNOWLEDGEMENTS
REFERENCES