전자부품 패키지에 내재된 두재료 혹은 세재료 접합점에 대한 응력특이차수

Order of Stress Singularities at Bonded Edge Corners with Two or Three Dissimilar Materials in the Eletronic Package

Order of stress singularities at bonded Edge Corners with two or three dissimilar isotropic Materials is analyzed. The problem is formulated by Mellin transform and characteristic equation is obtained as a determinant of matrix considering boundary conditions. Roots of characterictic equation are determinde by numerical calculations with ward method, from which the order of stress sigularities is obtained. Applying the results to the electronic packaging, the order of stress singularities is obtained. Applying the results to the electronic packaging, the order of stress singularities at bounded edge corners is calculated as a various bouned edge angle with given material combinations. Comparing the results, the optimal material combinaitons of bounded edge corners and bouned edge angle to reduce stress singularity could be determined. It suggests that the results are used to the basic design of electronic packaging reducing the stress singularity.