THE RECENT TREND OF BUILD-UP PRINTED CIRCUIT BOARD TECHNOLOGIES
THE RECENT TREND OF BUILD-UP PRINTED CIRCUIT BOARD TECHNOLOGIES
- 한국표면공학회
- Journal of the Korean institute of surface engineering
- Vol.32 No.3
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1999.01289 - 296 (8 pages)
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The integration of the LSI has been greatly improved and the circuit patters on the LSI are becoming finer line and pitch. The high-density electronic packaging technology is improved. In order to realize the high-density packaging technology, the density of the circuit wiring of the printed circuit boards have also been more dense. The build-up process multilayer printed circuit board technology have a lot of vias, possibilities of the finer conductor wirings and have a freedom of capabilities of wiring design. The build-up process printed circuit boards have the wiring rules which are the pattern width: $100-20\mu\textrm{m}$, the via hole diameter: $100-50\mu\textrm{m}$. There three kinds of build-up processes as far materials and hole drilling. In this paper, the recent technology trends of the build-up printed circuit board technologies are described.
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