Interface Characteristics of Ion Beam Mixed Cu/polyimide system

Cu(400<TEX>$AA$</TEX>)/Polyimide has been mixed with 80 keV Ar+ and N2+from 1.0X1015ions/<TEX>$ extrm{cm}^2$</TEX> to 2.0X1016 ions/<TEX>$ extrm{cm}^2$</TEX>. The changes of chemical bond and internal properties of sample are investigated by X-ray photoelectron spectroscopy(XPS). The quantitative adhesion strength is measured by using scratch test. The optimized mixing condition is that Cu/PI is irradiated with 80 keV N2+ at a dose of 1.0X1015 ions/<TEX>$ extrm{cm}^2$</TEX>, because N2+ ions can product more pyridine-like moiety, amide group, and tertiary amine moiety which are known as adesion promoters than Ar+.