극히 얇은 코발트 실리사이드 접합을 위한 IIM 공정에 관한 연구

A Study on IIM Process for Ultra-Shallow Cobalt Silicide Junctions

IIM(Implantation Into Metal) process usning Co silicides has been investigated to obtain ultra-shallow junctions less than 0.1<TEX>$mu$</TEX>m. Rapid Thermal Annealing using halogen lamps was employed to form CoSi<TEX>$_2$</TEX> and junctions simultaneously.. Resistivities of CoSi<TEX>$_2$</TEX> were 13-17<TEX>$mu$</TEX> <TEX>$Omega$</TEX>-cm. CoSi<TEX>$_2$</TEX>/p<TEX>$^{+}$</TEX>/Si and CoSi<TEX>$_2$</TEX>/n<TEX>$^{+}$</TEX>/Si junction were formed by diffusion of B and As, respectively, from Co film. It was found out that B and As were severely lost by the evaporation during high temperature annealing Therefore SiO<TEX>$_2$</TEX> capping layers were introduced to prevent the evaporation of the implanted dopants from the films. Investigation of the behavior of dopants with respect to annealing time revealed that increasing the annealing time enhanced the diffusion of dopants into Si from CoSi<TEX>$_2$</TEX>.