전자회로 일체형 돔 형상의 플라스틱 부품 성형에 관한 연구

A study on the molding of dome shaped plastic parts embedded with electronic circuits

Smart systems in different application areas such as automotive, medical and consumer electronics require anovel manufacturing method of electronic, optical and mechanical functions into products. Traditional methods includingmechanical assembly, bonding of plastic and electronic circuit cause the problems in large size of products andcomplicated manufacturing processes. In this study, thermoforming and film insert molding were applied to fabricate adome shaped plastic part embedded with electronic circuits. The deformation of patterns printed on PET film waspredicted by thermoforming simulation using T-SIM, and the results were compared with those by experiment. In orderto decrease spring-back after thermoforming, the Taguchi method of design of experiment was used . Through ANOVAanalysis, it was found that mold temperature was the most dominant parameter for spring-back. By using flow analysis,gate design was performed to decrease injection pressure. During film insert molding, the wash-out of ink printed on filmoccurred for Polycarbonate. When the resin was changed to PMMA, the wash-out disappeared due to low melttemperature.

Smart systems in different application areas such as automotive, medical and consumer electronics require anovel manufacturing method of electronic, optical and mechanical functions into products. Traditional methods includingmechanical assembly, bonding of plastic and electronic circuit cause the problems in large size of products andcomplicated manufacturing processes. In this study, thermoforming and film insert molding were applied to fabricate adome shaped plastic part embedded with electronic circuits. The deformation of patterns printed on PET film waspredicted by thermoforming simulation using T-SIM, and the results were compared with those by experiment. In orderto decrease spring-back after thermoforming, the Taguchi method of design of experiment was used . Through ANOVAanalysis, it was found that mold temperature was the most dominant parameter for spring-back. By using flow analysis,gate design was performed to decrease injection pressure. During film insert molding, the wash-out of ink printed on filmoccurred for Polycarbonate. When the resin was changed to PMMA, the wash-out disappeared due to low melttemperature.