Preparation of copper nanoparticles with an organic coating by a pulsed wire discharge method

Preparation of copper nanoparticles with an organic coating by a pulsed wire discharge method

In the pulsed wire discharge method, a coating technique to prepare metal nanoparticles covered with organic matter has been investigated. Copper nanoparticles covered with organic matter have been successfully prepared by evaporation of a copper wire in an oleic acid vapor/mist. The thickness of the coating layer was a few nanometres. The median diameter of the powder was 25 nm, and became 10 nm smaller than that without the coating because of the inhibition of particle growth by the formation of the coating. From phase identification by transmission electron microscopy and X-ray diffraction analysis, it was found that the copper nanoparticles have been passivated and have not been oxidized in over 2 months.

In the pulsed wire discharge method, a coating technique to prepare metal nanoparticles covered with organic matter has been investigated. Copper nanoparticles covered with organic matter have been successfully prepared by evaporation of a copper wire in an oleic acid vapor/mist. The thickness of the coating layer was a few nanometres. The median diameter of the powder was 25 nm, and became 10 nm smaller than that without the coating because of the inhibition of particle growth by the formation of the coating. From phase identification by transmission electron microscopy and X-ray diffraction analysis, it was found that the copper nanoparticles have been passivated and have not been oxidized in over 2 months.