QFN 패키지의 Resin Bleed와 Melting 검출 알고리즘

Algorithm for Segmenting Resin Bleed and Melting on the Surface of QFN Packages

There are many different types of surface defects on semiconductor Integrated Chips (IC"s) caused by various factors during manufacturing process, such as Scratch, Flash, Resin bleed, and Melting. These defects must be detected and classified by an inspection system for productivity improvement and effective process control. Among defects, in particular, Resin bleed and Melting are the most difficult ones to classify accurately. The brightness value and the shape of Resin bleed and Melting defects are so similar that normally it is difficult to classify the Resin bleed and Melting. In this paper, we propose a segmenting method and a set of features for detecting and classifying the Resin bleed and Melting defects.

There are many different types of surface defects on semiconductor Integrated Chips (IC"s) caused by various factors during manufacturing process, such as Scratch, Flash, Resin bleed, and Melting. These defects must be detected and classified by an inspection system for productivity improvement and effective process control. Among defects, in particular, Resin bleed and Melting are the most difficult ones to classify accurately. The brightness value and the shape of Resin bleed and Melting defects are so similar that normally it is difficult to classify the Resin bleed and Melting. In this paper, we propose a segmenting method and a set of features for detecting and classifying the Resin bleed and Melting defects.