Comparative evaluation of the microbial leakage at two different implant abutment interfaces using a new sealant
To evaluate the microbial leakage at two different implant abutment interfaces using a new sealant. Forty implants of the size 4.2 Dx11.5 L (Adin, Israel), internal hex, were selected. Twenty Titanium abutments (Adin, Israel) with twenty titanium implants were used in Group 1, Twenty CAD/CAM Zirconia abutments with twenty titanium implants were used in Group 2. Each group was subdivided into two subgroups, Subgroup A- Control without sealant and Subgroup B- with new sealant. Implants were immersed in brain heart infusion broth (Accumix Microxpress, India) and a poly microbial solution (ATCC 10556 Streptococcus sanguis, Himedia, India and ATCC 90030 Candida glabrata Himedia, India) was introduced into the eppendorf tubes (Tarson, India) containing the implant assemblies of the four subgroups and incubated for 14 days. Then samples from implant wells were taken using sterile absorbent paper points (Diadent, Korea) and cultured in Mueller Hinton agar (HimediaIndia) .The colonies formed were counted using digitalcolony counter. The results obtained were tabulated and statistically analysed. Mann Whitney U test was used to compare the values between the two groups. There was a significant difference in microbial leakage in Titanium abutments with and without the new sealant for both microorganisms (P<0.05). There was a significant difference in microbial leakage in Zirconia abutments with and without the new sealant for both microorganisms (P<0.05).There was no statistically significant difference in microbial leakage between Titanium and Zirconia abutments with new sealant for both the microrganisms (P>0.05). There was significant reduction in microbial leakage for both microorganisms on application of this new sealant in both Titanium and Zirconia abutments over Titanium implants. The new sealant used has both antibacterial and antifungal efficacy on usage with both types of abutments over Titanium implants.
MATERIALS AND METHODS